December 23, 2016

Green Hills Software and INTEGRITY Security Services to Present and Exhibit at CTS/CES 2017 in Las Vegas, NV

Huawei selects Rohde & Schwarz for NB-IoT base station testing in line with 3GPP Rel. 13

Arastu System’s LPDDR3 Controller Core for Extended Battery Life

Antenova commits to helping designers achieve “right first time” wireless design – by providing a free Transmission Line Calculator tool and other resources

December 22, 2016

Velodyne LiDAR Announces Breakthrough Design for Miniaturized, Low Cost Solid-State LiDAR Sensors

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

December 21, 2016

Nordic Semiconductor's Bluetooth 5-Enabled nRF52840 Dev Kit Now Shipping from Mouser

3U VPX Power Card Released for Military and Industrial Embedded Technology Markets

Toshiba Expands Lineup of Embedded NAND Flash Memory Products for Automotive Applications

element14 launches ‘Safe & Sound’ Wearables Design Challenge

XP Power offers encapsulated 80 Watt AC-DC modules in an ultra-compact footprint

CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES

December 20, 2016

ON Semiconductor Demonstrates Complete USB Type-C Solutions for Rapid Charging and High-Speed Data Transfer at CES 2017

Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017

STMicroelectronics and Valencell Announce Collaboration on Highly Accurate and Powerful Biometric Sensor Platform for Wearables and IoT

December 19, 2016

Ericsson scales new heights for power handling and thermal management with advanced bus converter

EMA Launches ‘Official Holiday Caption Contest'

World First NB-IoT Base Station acceptance testing at CMCC, supported by Rohde & Schwarz

GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions

Pizzicato Comes of Age

INTEGRITY Security Services Delivers Certificates for V2V Communication

IEEE and Barr Group Emphasize the Importance of Software Safety at Special Event

Anritsu Company Introduces Industry's First Test Automation Tool that Addresses Both RF and Optical Testing Needs

December 16, 2016

Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution

VadaTech launches new Virtex UltraScaleTM FPGA Carrier

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