July 16, 2015

congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics

Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT

Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive

Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development

Digi-Key Partners with ARM University Program to Offer 'Lab-in-a-Box' for Participating Universities Worldwide

2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current

July 15, 2015

Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems

Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression

crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios

Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line

Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

July 14, 2015

GrammaTech's TECHx Research Team Selected as Finalist in DARPA's Cyber Grand Challenge

Atmel Launches IoT Cloud Ecosystem Partner Program, Accelerating Internet of Things Development

Mouser Adds Adafruit to Its Open Source Lineup

Enics invests in Zuken’s CR-8000 software to future-proof electronics manufacturing services

Versatile 35VIN/35VOUT Synchronous Buck Battery Charger Controller Offers up to 20A Charge Current, Multichemistry Operation & Digital Telemetry

Imec and Panasonic Demonstrate Breakthrough RRAM Cell

MEMSIC Launches First High Performance Bi-Directional Flow Sensors for Medical and Industrial Applications

SPARK Going to the Moon

High-Performance Automotive Hall Effect Latch from Diodes Incorporated Features Wide Range of Sensitivity Options

Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Successfully Flies on Northrop Grumman’s FlightPro Gen III Mission Computer

650V IGBTs from STMicroelectronics Boost Efficiency in 20kHz Power-Switching Applications

Imec and SPTS Technologies, an Orbotech Company, Collaborate on Critical Processes for 3D IC Wafer Stacking

July 13, 2015

Leti Reports FinFET Feasibility and Circuit Design for Better Area, Speed and Power Trade-offs with CoolCube Technology

Keysight Technologies’ EDA Simulation Tools Seminar Details Solutions for Solving Signal/Power Integrity Challenges


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