August 04, 2016

Silicon Labs Launches Industry’s First High-Speed Multi-Channel PLC Input Isolators

Antenna Company Launches SuperShape® Antenna Technology for Greatly Improved Wi-Fi, GPS and Cellular Performance

August 03, 2016

Cadence Delivers Industry’s First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions

AVX Releases New 2.9GHz High Performance, Low Pass Integrated Thin Film Filter in Ultra Miniature 0805 Case

Lime Micro Collaborates with On.Lab on the CORD Project for M-CORD Solution POC

Octal Bus Transceiver with Hot Insertion and Bus-Hold Capability adds to Diodes Incorporated’s Logic Portfolio

Dynatrace announces dedicated digital performance monitoring resource for 2016 Olympic Games

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

Targeted debugging of MIPI M-PHY interfaces using the new triggering and decoding option for R&S RTO2000 oscilloscopes

Artesyn Announces SharpSwitch™ Dual 100G Intelligent Network Interface Card

Phononic Unveils Pico-TEC Series to Provide Precise Temperature Control for Optical Electronics

Toshiba Starts World’s First Sample Shipment of 64-Layer 3D Flash Memory

STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package

August 02, 2016

Semtech LoRa® RF Technology for IoT Used in Compact Wireless Module from Murata

Dimmable LED Controllers from Diodes Incorporated Drive Lamps up to 150W with High Power Factor

New Scope Offers Best-in-class Signal Visualization Starting at $1,200

EMA Acquires Accelerated Designs for its Extensive Part Library and Expertise

ADLINK Announces its First COM Express® 3.0 Type 7 Computer-on-Module

Optimal+ Announces Availability of Electronics Solution with Release 6.5

Avnet Expands Global Franchise with Cypress to Include Newly Acquired IOT Products

PCB® Launches New High Temperature Charge Accelerometer with UHT-12™ Element

New USBXpress Controller from Silicon Labs Simplifies USB Connectivity for Embedded Designs

Waterproof Buzzers Developed for High-Moisture Environments

MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications

August 01, 2016

ADLINK Plays Key Role in Update of PICMG’s COM Express® Standard and Associated Type 7 Pinout


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