July 12, 2016

Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design

IRT Nanoelec and CMP Announce World’s First Multi-Project Wafer Service with Silicon Photonics on 310nm SOI Platform

Keysight Technologies Introduces Industry’s First All-in-One Software for R&D Engineers Designing, Evaluating 5G Candidate Waveforms

Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes

Small Footprint Secondary-Side MOSFET Driver from Diodes Incorporated Reduces BOM Cost in 5V to 12V Power Supplies

Avalue Introduces HPC-BYT for IoT and Industry 4.0 Applications

July 11, 2016

SiFive Introduces Industry’s First Open-Source Chip Platforms

Mentor Graphics Extends the PADS PCB Product Creation Platform with Advanced Analog/Mixed-Signal and High Speed Analysis for Mainstream Engineers

Intersil Announces Industry’s First Rad Tolerant 36V Instrumentation Amplifier with Integrated Differential ADC Driver

Synopsys Releases Coverity 8.5 Static Analysis Tool

Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond

Applied Materials’ Next-Generation E-Beam Inspection System Provides Industry’s Highest Resolution

KLA-Tencor Introduces Comprehensive Wafer Inspection and Review Portfolio for Leading IC Technologies

July 08, 2016

Percepio Launches Tracealyzer for Micrium’s µC/OS-III with Streaming Trace

RS Components first to market with NFC timing relays from Schneider Electric

Micron Introduces Industry's Best-in-Class SLC NAND Flash for IoT and Automotive

July 07, 2016

Multiprotocol Transceiver Simplifies Industrial Designs & Supports Legacy Peripherals

Compact 1 W and 2 W DC-DC converters target medical applications

Modelithics and Coilcraft Collaborate to Offer New Microwave Global Models™ for High Frequency Conical Inductor Series

Intersil’s 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and Electric Vehicle Battery Systems

ADLINK Introduces Network Appliance & Media Cloud Server Based on Intel® Xeon® Processor E5-2600 v3/v4 and Intel® Xeon® Processor E3-1500 v5 Product Families for High Performance, Compute Intensive Solutions

STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power STM32L4 Microcontroller Series

July 06, 2016

D3 Engineering announces availability of DesignCore™ ADAS Development Kit, featuring reference design with Texas Instruments TDA3x automotive vision processor

Intersil Unveils Industry’s Highest Performance Laser Diode Driver for Automotive Heads-Up Displays

Nordic Semiconductor launches the most advanced, high-performance single chip Bluetooth low energy SoC in a tiny package size


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