industry news
Subscribe Now

COBO selects connector for upcoming standard, paving path to multi-sourced on-board optics

Los Angeles, California, March 20, 2017: The Consortium for On-Board Optics (COBO) today announced it has chosen the electrical connector for its upcoming standard which defines the key component for mounting on-board optical modules to printed circuit boards (PCBs) – significantly progressing the development of what will be the first truly multi-sourced on-board optics modules.

The connector selection is the outcome of months of collaborative industry effort which has resulted in the adoption of a combination of a TE Connectivity proposal and a Samtec proposal. The selection includes TE Connectivity’s connector proposal for the high-speed connection, where 50Gbps per lane electrical signals pass between the PCB and the module, and Samtec’s connector proposal for the low-speed connection, bringing DC power, control and management interface to the module. With input from COBO members, the combination will ultimately advance to a final socketed form factor for on-board optics.

The selection of these connector proposals by the Data Center Networking (DCN) working group within COBO – which will mark its second anniversary at OFC 2017 – is a huge step forward for the optics industry. The DCN working group has been focusing on lowering deployment costs, helping to avoid vendor lock-in and growing the optics market, while developing an 8-lane wide and a 16-lane wide connector to enable modules to support 400G to 2x 400G modules, respectively. Investigation is underway to consider modules that can support 1.6T using the 16-lane wide connector. Following the selection of the connector, the DCN working group is now refining the dimensions of the optical module to permit detailed mechanical design and electrical evaluation to enable module integrators to begin the development and testing of prototypes.

“This is a significant achievement which is the culmination of months of joint effort that allows our work to move forward and provides a stellar example of industry collaboration,” said Jeffery J. Maki, Vice President of COBO and Chairman of the DCN working group. “As a result of the selection of an electrical connector specification, system companies and module integrators will be able to develop solutions based on on-board optics to satisfy their end-customers’ requirements.” 

Since it was launched in 2015 with assistance from Microsoft, COBO has grown to include more than 60 members and has launched a new working group. The Coherent working group, chaired by Hugues Tournier, of Ciena, was initiated to address the market for coherent optical technology that is typically used in metro and long-haul optical networks. This working group plans to re-use the connector specification adopted by the DCN working group with a focus on higher thermal performance. The two groups run in parallel.

“COBO members have made significant progress since our launch two years ago,” said Brad Booth, COBO President and Microsoft Principal Architect. “The selection of the connector is a major step forward that resulted from inputs on electrical performance, thermal modeling and PCB design considerations. COBO is a truly unique organization within the optics industry in that we are defining a module which can carry us through more than one generation of speed while enabling the industry to prepare for the inevitable progression of optics inside the box.”

Further insight into COBO’s activities will be revealed during this week’s OFC Conference, in Los Angeles, where COBO will host a panel on the challenges, discoveries and what is next for on-board optics on Wednesday, March 22 at 10.15am in Expo Theater II. Speakers will include: 

·         Robert Blum, Director of Strategic Marketing and Business Development at Intel;

·         Ed Frlan, Senior System Architect at Semtech;

·         Jignesh Shah, Sr. Product Architect at Samtec;

·         Hugues Tournier, Senior Manager, Power and Signal Integrity, at Ciena;

·         Nathan Tracy, Technologist at TE Connectivity; and

·         Brad Booth, President of COBO.

9 thoughts on “COBO selects connector for upcoming standard, paving path to multi-sourced on-board optics”

  1. Pingback: GVK BIO
  2. Pingback: binaural
  3. Pingback: www.cpns2016.com
  4. Pingback: DMPK
  5. Pingback: hash belgie
  6. Pingback: agen bola terbesar
  7. Pingback: Diyala Engineering
  8. Pingback: blog link

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Peak Power Introduction and Solutions
Sponsored by Mouser Electronics and MEAN WELL
In this episode of Chalk Talk, Amelia Dalton and Karim Bheiry from MEAN WELL explore why motors and capacitors need peak current during startup, the parameters to keep in mind when choosing your next power supply for these kind of designs, and the specific applications where MEAN WELL’s enclosed power supplies with peak power would bring the most benefit.
Jan 22, 2024
13,247 views