industry news
Subscribe Now

Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution

SAN JOSE, Calif., Dec 15, 2016—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Sentons licensed the Cadence® Tensilica® ConnX BB32EP DSP for a new ultrasound technology that is dramatically changing the human interface landscape for mobile and touch-enabled devices. Sentons selected the ConnX DSP for its unparalleled complex signal processing performance in a low-power envelope for mobile applications. The optimized DSP software library and fully integrated toolchains for processor and software development enabled Sentons to focus on their advanced interface technology and achieve rapid time to market.

“Mobile device manufacturers are seeking new ways to innovate and improve the user interface capabilities in their products. Replacing commodity capacitive technologies with Sentons’ ultrasound-based sensing technology enables the application of touch sensing not only on glass but also on metal and curved surfaces. It also allows force and pressure sensing with zero deformation of the touch surface,” said Sam Sheng, CEO at Sentons. “This technology is centered around sophisticated new algorithms running on the Cadence Tensilica ConnX BB32EP DSP. A powerful 32-way MAC SIMD, 5-issue VLIW DSP with outstanding support for complex vector and matrix advanced algebra, the BB32EP’s high performance and low power were the perfect match for Sentons’ new SoC.”

“Sentons’ highly innovative signal processing was enabled by a Tensilica heterogeneous multicore solution including the ConnX BB32EP and an Xtensa® controller that provides outstanding complex signal processing performance in a low-power envelope for mobile applications,” said Chris Jones, group director of DSP Marketing at Cadence. “Supported by a complete, industry-proven set of tools and libraries, Tensilica provided an ideal solution for Sentons’ new ultrasound technology.”

For more information about the Tensilica ConnX BB32EP DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Enabling IoT with DECT NR+, the Non-Cellular 5G Standard
In the ever-expanding IoT market, there is a growing need for private, low cost networks. In this episode of Chalk Talk, Amelia Dalton and Heidi Sollie from Nordic Semiconductor explore the details of DECT NR+, the world’s first non-cellular 5G technology standard. They investigate how this self-healing, decentralized, autonomous mesh network can help solve a variety of IoT connectivity issues and how Nordic is helping designers take advantage of DECT NR+ with their nRF91 System-in-Package family.
Aug 17, 2023
30,118 views