industry news
Subscribe Now

Scale from value line to high performance with TI’s new unified memory 16-bit microcontrollers (MCUs)

DALLAS (Nov. 3, 2016) –Texas Instruments (TI) (NASDAQ: TXN) today expanded its ultra-low-power MSP430™ FRAM microcontroller (MCU) portfolio with two new low-power families targeting a wide range of sensing and measurement applications. The new families include:

  • MSP430FR5994 MCUs with 256KB FRAM and 40 times the performance of other low-power MCUs providing developers digital signal processing (DSP) capabilities with a new and easy-to-use integrated low energy accelerator (LEA).
  • MSP430FR2111 MCUs to upgrade your 8-bit designs with the expanded  TI MCU Value Line portfolio and the first to include unified FRAM memory in a small 3×3 mm QFN package.

The new MCUs extend the portfolio from 2KB to 256KB of integrated ferroelectric random access memory (FRAM) technology, which is a non-volatile memory technology that offers unmatched flexibility and ultra-low power performance. Additionally, the MSP430 FRAM ecosystem includes thousands of existing software libraries, application notes and driver framework to simplify development across the portfolio.

Easily process complex algorithms with MSP430FR5994 MCUs

The new MSP430FR5994 MCUs help you save power by spending more time in standby thanks to the newly integrated low-energy accelerator (LEA)for  signal processing which completes fast Fourier transforms (FFTs), finite impulse response (FIR) and infinite impulse response (IIR) filters and other math functions nearly 40 times faster than an ARM® Cortex®-M0+ microcontroller. 256KB of unified memory (FRAM) allows for expanded application code, and addresses applications with large RAM requirements, all while offering write speeds 100 times faster than Flash with no buffering or pre-erase required. 

The LEA module provides an optimized DSP library with support for more than 50 math functions and a plug-and-play design that allows developers to unbox our MSP430FR5994 MCU LaunchPad™ development kit and start processing complex math algorithms in less than five minutes. MSP430 MCU developers now have a path to greater signal processing performance paired with the benefits of FRAM technology for a wide range of applications such as metering, building and factory automation equipment and portable health and fitness devices. For more information, visit www.ti.com/msp430fr5994-pr.    

Refresh your old 8-bit design with new MSP430FR2111 MCUs

The MSP430FR2111 MCUs allow developers to upgrade legacy 8-bit or 16-bit designs with a cutting-edge, highly integrated MCU with FRAM memory technology. Even the most cost conscious developer now has a solution that integrates a 10-bit analog-to-digital converter (ADC), EEPROM functionality, comparator, real-time clock, enhanced timers, internal oscillator with a 16-bit MCU in a tiny 3×3 mm package and a starting 1ku price of less than $0.50. With up to 50 times the RAM of comparable 8-bit MCUs thanks to unified memory, developers will no longer need to program in assembly, which will get them to market faster, simplify software maintenance and increase code portability. Additionally, the new MCUs offer seamless migration and scalability within the MSP430 MCU portfolio. Customers can move from MSP430G2x MCUs to the new MSP430FR2x MCU family with ease and then scale within the FRAM portfolio thanks to a common core architecture, tool ecosystem and easy-to-use migration guides. For more information, visit www.ti.com/msp430FR2111-pr.

Pricing and Availability

Developers can get started immediately with MSP430 MCU-based development kits available on the TI Store and through TI authorized distributors. The MSP430FR2x MCU LaunchPad development kit (MSP-EXP430FR2311) and the MSP430FR5994 MCU LaunchPad development kit (MSP-EXP430FR5994) are available for USD $15.99. 

Pre-release samples of the MSP430FR5994 MCU can be ordered online today.  Additionally, the new MSP430FR2111 MCUs are available now in production quantities on the TI store or through authorized TI distributors. 

Learn more about TI’s scalable MSP430 FRAM MCU portfolio:

Leave a Reply

featured blogs
Apr 23, 2024
The automotive industry's transformation from a primarily mechanical domain to a highly technological one is remarkable. Once considered mere vehicles, cars are now advanced computers on wheels, embodying the shift from roaring engines to the quiet hum of processors due ...
Apr 22, 2024
Learn what gate-all-around (GAA) transistors are, explore the switch from fin field-effect transistors (FinFETs), and see the impact on SoC design & EDA tools.The post What You Need to Know About Gate-All-Around Designs appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Automotive/Industrial PSoC™ High Voltage (HV) Overview
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Marcelo Williams Silva from Infineon explore the multitude of benefits of Infineon’s PSoC 4 microcontroller family. They examine how the high precision analog blocks, high voltage subsystem, and integrated communication interfaces of these solutions can make a big difference when it comes to the footprint size, bill of materials and functional safety of your next automotive design.
Sep 12, 2023
27,505 views