industry news
Subscribe Now

Imperas Expands University Partners Program

September 27, 2016 07:00 AM Eastern Daylight Time

OXFORD, England — Imperas Software Ltd. today announced the expansion of the Imperas University Program, with 34 universities now participating. The worldwide Imperas University Program was created to inspire and support the next generation of technologists and innovators. It grants academic and research institutions access to the tools and technology needed to address difficult challenges across embedded software and systems, from development and test, to quality and standards compliance, to security and IoT, to system architecture and optimization. Through this program, Imperas software reaches thousands of students and professors worldwide every year.

Imperas University Partners Program expands to 34, providing virtual platforms, models for embedded software.

Universities currently using Imperas and OVP tools and models for coursework and research include:The Imperas University Program encourages participation in the embedded systems community in three ways: use on research projects, use in the classroom, and sharing of virtual platform models through the Open Virtual Platforms (OVP) Library.

Europe via Europractice

Europe

Americas

Asia

Andrew Schmidt at the University of Southern California’s Information Sciences Institute (USC/ISI) commented, “Imperas tools and models provide us with enhanced capabilities to pursue research we could not otherwise achieve with significantly less upfront development effort. The virtual platforms allow us to rapidly explore state-of-the-art prototypes and bridges the gap between hardware and software development.”

“Imperas OVP modeling and high-level simulation platforms unify both hardware and software development for multi-core designs, and are clearly the wave of the future. Access to the University Program allows my student’s access to advanced technologies essential to their future endeavors” stated Professor Jong Tae Kim of Sungkyunkwan University (SKKU).

Professor Fernando Gehm Moraes at the Pontifical Catholic University of Rio Grande do Sul, (PUCRS) said “At PUCRS, we use Imperas virtual platforms in projects on multiprocessor SoC modeling, power evaluation, and programmability, as well as computer science graduate program courses on SoCs and research architecture. Our research group (Grupo de Apoio ao Projeto de Hardware, or Hardware Design Support Group), also leverages these tools.

Recent projects, presentations and publications include:

“Virtual platforms are critical to meet the challenges of increasing software complexity, and security, that today’s students will face,” said Duncan Graham, university program manager for Imperas. “Imperas is investing in the next generation of innovators, who will help revolutionize embedded software development.”

Over 7,000 students and academics from over 1,000 university departments currently subscribe to the Open Virtual Platforms website, which features freely available processor core models and OVP-based virtual platforms. These models work with the Imperas and OVP simulators, including the QuantumLeap parallel simulation accelerator with performance of over ten billion instructions per second.

For more information on the Imperas University Program, please email univ@imperas.com.

About Imperas

For more information about Imperas, please see www.imperas.com. Follow us on Twitter @ImperasSoftware and on LinkedIn.

 

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Embedded Storage in Green IoT Applications
Sponsored by Mouser Electronics and Swissbit
In this episode of Chalk Talk, Amelia Dalton and Martin Schreiber from Swissbit explore the unique set of memory requirements that Green IoT designs demand, the roles that endurance, performance and density play in flash memory solutions, and how Swissbit’s SD cards and eMMC technologies can add value to your next IoT design.
Oct 25, 2023
23,788 views