industry news
Subscribe Now

Brite Semiconductor Releases “YOU” Brand IP Portfolio and Silicon Platform Solution

Shanghai, China—April 13, 2016— Brite Semiconductor Corp. (“Brite”) announced today the release of a brand-new “YOU” IP portfolio and silicon platform solution. Based on more than 8 years successful experience of design service and IP development on the cutting-edge processes, Brite provides “YouIP” which means “IP belongs to YOU” portfolio solution and silicon platform to assist customer to win emerging markets like IoT, wearable devices, mobile, consumer electronics and so on, combining with comprehensive ASIC design service solution and trusted manufacturing partner SMIC. YouIP is an IP and platform family attributing to not only Brite, but also our customer-YOU.

YouIP consists of 3 branches as YouPHY, YouRF and YouSiP, providing comprehensive silicon proven IP and platform that customer can achieve their product from specification definition, design to silicon with higher one time delivery rate and shorter time to market.

Brite provides silicon proven harden interface IPs for a variety of growing application of high speed transmission.

  • Brite provides a complete DDR subsystem including not only controller, PHY and IO, but also corresponding tuning and configuration software. And this solution can support LPDDR2, DDR3, LPDDR3, DDR4 and LPDDR4 combo PHY with the data rate from 667Mbps to 2933Mbps. YouPHY-DDR is developed on 130um to 28nm process respectively and delivers an unbeatable combination of DDR high speed and low power performance. With patented dynamic self-calibrating logic (DSCL) and dynamic adaptive bit calibration (DABC) technology, YouPHY-DDR can automatically compensate chip/package/board/memory PVT variation and bit-bit skew. YouPHY-DDR delivers the highest DDR performance, the smallest area and the shortest time-to-market.

  • Brite provides USB2.0 OTG PHY which is a complete mixed-signal IP solution designed to implement OTG connectivity for a System-on-Chip (SoC) design. The USB2.0 OTG PHY supports the USB2.0 480Mbps protocol and data rate, and is backward compatible with the USB 1.1 1.5Mbps and 12Mbps protocol and data rates. This solution can be adapted from 130nm to 28nm process. It has been verified by a number of end products, especially suitable for the current popular internet of things applications.

Brite provides a complete Bluetooth Low Energy (BLE) analog PHY. The RF is a high performance 2.4GHz ISM band wireless transceiver. It integrates high sensitivity receivers, 5G PLL and high efficiency power amplifier, which can support 1Mbps GFSK modulation and demodulation, and can be combined with the Bluetooth smart baseband and controller to form a complete Bluetooth Smart solution.

YouSiP is an amazing silicon proven platform. In order to shorten time–to-market and reduce the NRE cost & development risk of audio, vision, IoT and AP products, Brite integrates the rich IP resources of themselves and strategic partners to design a complete SoC system and EVB for these applications. And each platform is launched through silicon validated and product-like application proven. Therefore, customers can be easier to build up their owned SoC product referring to these prototypes design.

Audio/Voice DSP reference design platform is developed based on the CEVA-TeakLite-4 DSP core and fabricated at SMIC’s 55nmLP process, running up to 500MHz. The platform provides designers with a powerful means to add “smart and connected” capabilities to these devices, including always-on sensing, local processing and intelligence connectivity. The platform also provides real-time power measurement that allows developers to improve power consumption of system by optimizing their DSP software effectively. It provides a complete development and demo system integrating DSP and multiple peripherals & interfaces IP, and supports diverse wireless technologies including Bluetooth Smart and Smart Ready, Wi-Fi, ZigBee and GNSS. It can be adopted on mobile, wearable devices, wireless speaker, smart home, surveillance, automotives and so on.

It is an image signal processer (ISP) platform integrated with CEVA XM4, and some high speed interface IPs as MIPI, PCIe, LPDDR3 and USB which is developed based on SMIC 28nm, 40nm process. It can support 3D vision including real-time 3D depth map generation and point cloud processing for 3D scanning, computational photography algorithms including refocus, background replacement, zoom, super-resolution, image stabilization, HDR, noise reduction and improved low-light capabilities, visual perception including deep learning, object detection, recognition & tracking, context aware, augmented reality(AR) and others. This platform targets any camera-enabled devices such as smartphones, tablets, automotive safety (ADAS) and infotainment, robotics, security and surveillance, augmented reality (AR) and virtual reality (VR) and drones.

  • It is a comprehensive platform solution designed for emerging application as IoT based on SMIC 55nm low leakage (LL) and 95nm ultra low power (ULP) process which can provide embedded non-volatile flash memory as well. This solution integrates ARM Cortex Mx series MCU and CEVA TeakLite or MM series DSP, involves WiFi, Bluetooth/BLE interfaces, which can connect to a series of different sensors. YouSiP-IoT platform can assist customer to reduce the processing delay time, enhance the data security, improve the data rate and reduce power consumption of their SoC design, which is adopted in battery power supply environment as smart home, IoT and wearable devices with excellent low power management.

  • YouSiP provides an ARM Cortex-A series core architecture based on SoC platform prototype which has been verified on SMIC 28nm and 40nm process. Its complete development tool including ISP/ICP tools, development boards, reference code and programmer and peripheral IPs can be offered to customer, enabling customer to achieve SoC product with shorter time to market and higher one time delivery rate and assisting them win the emerging market opportunities in the field of industrial control, home appliance, security, toys, mobile devices, etc.

Above silicon proven IP and platform solutions provided by Brite can assist customer to design their products efficiently. Brite will continue to develop and release more and more silicon proven IP and platform to supplement YouIP portfolio in order to support the requirements from customer.

For more information, please visit our homepage www.britesemi.com or contact us via sales_bs@britesemi.comdirectly.

About Brite Semiconductor

Brite Semiconductor is a world-leading ASIC design services company, providing customers with ULSI ASIC/SoC chip design and manufacturing services. Brite Semiconductor was co-founded by Semiconductor Manufacturing International Corporation and Open-Silicon, as well as venture capital firms from China and abroad. As the strategic partners, SMIC and Open-Silicon provide Brite Semiconductor with strong technical and manufacturing support. Targeted at 90nm/65nm/40nm and high-end SoC design services, Brite Semiconductor provides flexible turn-key service from RTL/netlist to chip delivery, and seamless, low-cost, and low-risk solutions to customers.

Leave a Reply

featured blogs
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...
Apr 16, 2024
Learn what IR Drop is, explore the chip design tools and techniques involved in power network analysis, and see how it accelerates the IC design flow.The post Leveraging Early Power Network Analysis to Accelerate Chip Design appeared first on Chip Design....
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

LEMBAS LTE/GNSS USB Modem from TE Connectivity
In today’s growing IoT design community, there is an increasing need for a smart connectivity system that helps both makers and enterprises get to market quickly. In this episode of Chalk Talk, Amelia Dalton chats with Jin Kim from TE Connectivity about TE’s LEMBAS LTE/GNSS USB Modem and how this plug-and-play solution can help jumpstart your next IoT design. They also explore the software, hardware, and data plan details of this solution and the design-in questions you should keep in mind when considering using the LEMBAS LTE/GNSS USB modem in your design.
Apr 20, 2023
40,848 views