industry news
Subscribe Now

TI introduces lowest latency, highest ESD industrial Gigabit Ethernet PHYs, enabling real-time Industry 4.0 applications

DALLAS (Nov. 17, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s lowest latency and highest electrostatic discharge (ESD) industrial Gigabit Ethernet physical layers (PHYs). The new family of six devices enables engineers to bring real-time industrial Internet of Things (IIoT) capabilities to rugged factory automation systems, motor drives, and test and measurement equipment. The new DP83867 family meets stringent electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards, reduces power consumption, and offers designers flexibility with multiple temperature, media access control (MAC) interface and packaging options. For more information, visithttp://www.ti.com/dp83867-pr.

See the DP83867 in action in an Ethernet PHY demo in TI’s booth (No. 6-441) at the SPS IPC Drives conference, Nov. 24-26, in Nuremberg, Germany.

Key features and benefits of the DP83867 industrial Gigabit Ethernet PHYs

  • Industry’s lowest latency: Latency is less than 400 nanoseconds (ns) at 1,000 Mbps and 100 Mbps – 50 percent better than the competition. This reduces controller cycle times, improving real-time performance of standard IEEE 802.3 Ethernet connections in industrial systems.
  • Industry’s highest ESD protection: ESD protection exceeds 8 kV to surpass IEC 61000-4-2 standards, which is four times better than the competition. High ESD protection reduces the failure rate of Industry 4.0 systems by shielding against high-voltage faults.
  • EMI mitigation: The DP83867 exceeds stringent standards for EMI/EMC from International Electrotechnical Commission (IEC), Comité International Spécial des Perturbations Radioélectriques (CISPR) and European Standards (EN). By exceeding the EN55011/CISPR11 Class B-level testing standards, the DP83867 gives designers more design headroom so that they can go to production faster.
  • Power savings: Wake-on-local area network (LAN) (WoL) and power-down modes offer energy savings when the system is in a standby state. In addition, the DP83867 offers active power consumption of less than 460 mW, which is at least 30 percent lower than the competition.
  • Scalability across the temperature range: The DP83867 family offers options that allow designers to design across the full temperature range from -40oC to 105oC. This enables designers to adapt one design for multiple temperature environments, from commercial to extended industrial temperatures.

Tools and support to speed design

Evaluation modules (EVMs) available today from the TI store and authorized distributors enable designers to quickly and easily evaluate the new devices. The DP83867IRPAP-EVM supports the gigabit media independent interface (GMII) and reduced GMII (RGMII) and is priced at US$199, and the DP83867ERGZ-R-EVM supports RGMII and is priced at $199. Designers can download IBIS models and the JTAG BSDL model to further speed evaluation.

Designers can jumpstart their design with the EMI/EMC-compliant industrial-temperature-grade Gigabit Ethernet reference design, which includes the Sitara™ AM335x processor with integrated Ethernet MAC and switch.

Engineers can search for solutions, get help, share knowledge, and solve problems with fellow engineers and TI experts in the TI E2E CommunityEthernet forum.

Package, availability and pricing

The DP83867 industrial Gigabit Ethernet PHY family is available today with prices starting at US$4.40 in 1,000-unit quantities. Designers can select from two package options: a 48-pin quad-flat no-lead (QFN) package for space-constrained applications, and a 64-pin quad flat package (QFP) optimized for ease of use.

In addition to temperature grade options, several pin-to-pin compatible MAC interface options give designers flexibility to interface with various processors or field programmable gate arrays (FPGAs). These temperature and MAC interface options also help designers of non-industrial connected applications such as Internet Protocol (IP)-based network cameras, set-top boxes and computing applications meet the growing need for more rugged connectivity in their products.

Learn more about TI’s Ethernet portfolio

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog integrated circuits and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Must be Thin to Fit: µModule Regulators
In this episode of Chalk Talk, Amelia Dalton and Younes Salami from Analog Devices explore the benefits and restrictions of Analog Devices µModule regulators. They examine how these µModule regulators can declutter PCB area and increase the system performance of your next design, and the variety of options that Analog Devices offers within their Ultrathin µModule® regulator product portfolio.
Dec 5, 2023
19,415 views