industry news
Subscribe Now

Leti to Present Solutions to New Applications Using 3D Technologies at SEMICON West LetiDay Event, July 14

GRENOBLE, France – June 22, 2015 – CEA-Leti is hosting its 5th annual LetiDay San Francisco event, “Going Vertical with Leti: Solutions to new applications using 3D technologies”, during SEMICON West.

In addition, Leti experts will share their insights on the MEMS market at TechXPOT North on July 14 and on lithography at the Semiconductor Technology Symposium (STS) on July 15.
The July 14 LetiDay event for invited guests is scheduled from 5-9 p.m. in the fourth-floor Social Terrace at the W San Francisco hotel, 181 3rd St.

Topics include:

  • Welcome: Leti’s 3D integration for tomorrow’s devices, Leti CEO Marie Semeria
  • CoolCubeTM: 3D sequential integration to maintain Moore’s Law, Olivier Faynot, Leti Devices Department Manager
  • Photonics: why 3D integration is mandatory, Olivier Faynot
  • New non-volatile memory technologies, Hughes Metras, Vice President of Strategic Partnerships, North America
  • Computing: 3D technology for better performance, Severine Cheramy, 3DIC Laboratory Manager
  • Lighting: 3D integration for cost effectiveness, I. C. Robin, Strategic Marketing Manager, Lighting
  • Nanocharacterization for 3D, Pierre Bleuet, 3D Imaging Expert
  • Conclusion: Silicon ImpulseTM, Marie Semeria

Leti presentations at general sessions:

TechXPOT South, 10:30 a.m. to 12:30 p.m., July 14. Hughes Metras, Leti vice president for strategic partnerships/North America, will speak at the session on “What’s Next for MEMS”.

Semiconductor Technology Symposium (STS), 10 a.m. to 12:30 p.m., July 15, Moscone North, Hall E, Room 133. Laurent Pain, Leti patterning program manager – business development in the Silicon Technologies Division, will speak at the session on “Making Sense of the Lithography Landscape: Cost and Productivity Issues Below 14nm and the Path(s) to 5nm”. His topic is “The Leverage of Lithography Alternatives to Address High-end Technology Roadmap”.

Visit Leti in the European Pavilion, South Hall, Booth #2317, during SEMICON West

About Leti (France)

As one of three advanced-research institutes within the CEA Technological Research Division, CEA Tech-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on www.leti.fr and @CEA_Leti.

Leave a Reply

featured blogs
Mar 29, 2024
By Mark Williams, Sr Software Engineering Group Director Translator: Masaru Yasukawa 差動アンプはã1つの入力信号ではなく2つの入力信号間の差にゲインをé...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
20,016 views