industry news
Subscribe Now

Fairchild’s High-Current, High Efficiency MOSFETs Available in TO-Leadless Packaging for Automotive

SAN JOSE, Calif., March 2, 2015 /MobilityWire/ — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior.

Typical automotive power electronics applications for the TO-LL packaged devices include battery management for electric and hybrid-electric vehicles, battery safety switches, start-stop systems, as well as motor drives for EPS (electric power steering) and active rectification alternators. Fairchild offers devices optimized for traditional 12V battery systems as well as solutions supporting new board-net architectures, such as 48V.

“We combine our PowerTrench MOSFET technologies with the current carrying and thermal advantages of the TO-Leadless package to offer power switches with the industry’s lowest on-resistance,” said Heiner Gschloessl, Automotive Segment Director at Fairchild. “This combination gives designers enhanced switching performance and reliability for the most demanding automotive power applications.”

Highest efficiency, smaller, attractive system cost

At just 2.3 x 9.8 x 10.38mm, the TO-LL package is about 30 percent smaller compared to a D2PAK (TO263) package and supports up to 300A current handling capabilities. The TOLL is almost half the height, which makes it ideal for many automotive applications where space is usually tight.

The combination of Fairchild’s latest PowerTrench shielded gate trench technology with the TO-LL package gives Fairchild’s leadless MOSFET products their extremely low RDS(on) ranges. Both the superior silicon technology as well as the package design result in excellent switching and EMI performance, which is particularly beneficial for switching and PWM controlled applications in particular and has been verified by early customers of the devices. At the same time, it simplifies design, avoids additional passive components and overall enables electronic manufacturers to better serve the markets for high-current applications. Compared to other discrete packages, the number of parallel MOSFETs needed in high-current applications can be significantly reduced, if not eliminated, leading to overall lower system costs.

Fairchild’s TO-LL portfolio now includes 40V, 60V, 80V as well as 150V ratings and will extend to 100V types over the coming months.

 Part Number Package Voltage Rating Max RDS(on)
FDBL9401_F085 TO-LL (H-PSOF 8L) 40 V 0.65 m?
FDBL9403_F085 TO-LL (H-PSOF 8L) 40 V 0.9 m?
FDBL9406_F085 TO-LL (H-PSOF 8L) 40 V 1.2 m?
FDBL86561_F085 TO-LL (H-PSOF 8L) 60 V 1.1 m?
FDBL86563_F085 TO-LL (H-PSOF 8L) 60 V 1.5 m?
FDBL86361_F085 TO-LL (H-PSOF 8L) 80 V 1.4 m?
FDBL86363_F085 TO-LL (H-PSOF 8L) 80 V 2.0 m?
FDBL86366_F085 TO-LL (H-PSOF 8L) 80 V 3.2 m?
FDBL86210_F085 TO-LL (H-PSOF 8L) 150 V 6.3 m?

 

The TO-LL package features very low package parasitic compared to a D2PAK (TO263) package. Its inductances are only half the amount and the package resistance is only 40 percent. Unlike many other leadless packages, the TO-LL allows for automated optical inspection (AOI) thanks to its tin-plated lead tips. AOI is often a must for Surface Mount Technology (SMT) production lines as it supports low inspection cost compared to X-ray systems.

Further information

For additional information on TO-Leadless (H-PSOF 8L) and the complete Automotive MOSFET product offering please visit the TO-Leadless (TO-LL) package page on Fairchild’s website.

About Fairchild

Fairchild has a rich history as a pioneer in the semiconductor industry and that pioneering spirit endures today in our vision for making the world a cleaner and smarter place. We specialize in the development and manufacturing of a complete portfolio of low- to high-power solutions and deliver an amazing design experience to the engineers and system architects who build systems for the mobile, industrial, cloud, automotive, lighting, and computing industries. Our foundation is our guiding principles, which recognizes the inseparability of engaged employees and delighted customers, and encourages our employees to simplify, challenge, explore, play, excel, respect, go fast, and be direct. If you use a smart phone, drive a car, own a modern appliance, live and work in comfortable connected buildings, or enjoy film animation, you have experienced Fairchild’s Power to Amaze. Please visit us on the web at www.fairchild.com.

Leave a Reply

featured blogs
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...
Apr 16, 2024
Learn what IR Drop is, explore the chip design tools and techniques involved in power network analysis, and see how it accelerates the IC design flow.The post Leveraging Early Power Network Analysis to Accelerate Chip Design appeared first on Chip Design....
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Autonomous Robotics Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
Connectivity solutions for autonomous robotic applications need to include a variety of orientations, stack heights, and contact systems. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec explore trends in autonomous robotic connectivity solutions and the benefits that Samtec interconnect solutions bring to these applications.
Jan 22, 2024
12,244 views