industry news
Subscribe Now

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event

PITTSBURGH — (March 4, 2015) — MEMS Industry Group (MIG) announced today a technical event with a hands-on focus: MEMS Technical Congress, May 6-7, 2015 in Boston, Mass.

MEMS Technical Congress opens MIG’s annual technical event — formerly held for MIG members only — to non-member companies from the MEMS/sensors supply chain for the first time. Expanded attendance will further enrich the type of technical exchanges among attendees that have resulted in major initiatives in past years that are propelling the MEMS/sensors industry forward. These include IEEE 2700-2014 and the MEMS Foundry Engagement Guide.

MEMS Industry Group Executive Director Karen Lightman explained why the MEMS/sensors industry needs MEMS Technical Congress:

“While there are other technical conferences addressing MEMS and sensors, few if any are addressing near-term commercialization opportunities and challenges beyond the timeframe of the event,” said Ms. Lightman. “MIG has several very active working groups that meet throughout the year. It’s fitting that MIG embark on a technical congress to formally unite all the work that is currently going on under the MIG umbrella with input from potential MIG members and colleagues.”

Hands-on Technical Collaboration

In contrast with other MIG flagship events, such as MEMS Executive Congress US and Europe and MEMS Industry Group Conference Asia, MEMS Technical Congress focuses on critical technical issues of MEMS and sensors adoption, integration, commercialization and standards. Attendees include CTOs, vice presidents of engineering, design engineers, architects, product development engineers, academics and R&D managers.

All MEMS Technical Congress attendees can attend breakout sessions on Emerging MEMS & Sensors, Tech Transfer and Integration Challenges. Breakout sessions give attendees a structured way to take a deep dive into critical technical issues.

MEMS Technical Congress also features an opening keynote by Francis Gouillart, president of The Experience Co-Creation Partnership, several technically focused speakers, a tour of Draper Laboratory, and a dinner event co-hosted with Analog Devices.

Information and Registration

MEMS Technical Congress will be held May 6-7, 2015 at Hilton Boston Back Bay. For more information, please contact MIG via phone: +1 412.390.1644, email: chyppolite@memsindustrygroup.org.

Registration opens March 20, 2015 via the MEMS Technical Congress website at: http://memstechcongress.memsindustrygroup.org/

About MEMS Technical Congress 2015

MEMS Technical Congress is a one-of-a-kind technical conference, with a focus on working through MEMS/sensors supply chain challenges. The event is a place for neutral discussion of pre-competitive issues affecting MEMS manufacturing and brings together foundries, equipment vendors, research groups, large companies, startups, buyers, suppliers and other stakeholders for solutions knowledge, networking and resources to support the industry’s imminent MEMS/sensors commercialization needs.

About MEMS Industry Group

MEMS Industry Group (MIG) is the trade association advancing MEMS and sensors across global markets. Nearly 180 companies and partners comprise MIG, including Analog Devices, Applied Materials, ARM, Bosch, Broadcom, Freescale Semiconductor, GE, GLOBALFOUNDRIES, HP, IBM, Infineon, Intel, InvenSense, Lenovo, OMRON Electronic Components, Qualcomm, STMicroelectronics, SunEdison, Texas Instruments and TSMC. For more information, visit: www.memsindustrygroup.org.

MEMS Industry Group, MEMS Executive Congress and the MEMS Industry Group logo are registered trademarks, and MEMS Technical Congress is a trademark of MEMS Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders.

Leave a Reply

featured blogs
Apr 23, 2024
The automotive industry's transformation from a primarily mechanical domain to a highly technological one is remarkable. Once considered mere vehicles, cars are now advanced computers on wheels, embodying the shift from roaring engines to the quiet hum of processors due ...
Apr 22, 2024
Learn what gate-all-around (GAA) transistors are, explore the switch from fin field-effect transistors (FinFETs), and see the impact on SoC design & EDA tools.The post What You Need to Know About Gate-All-Around Designs appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Power Gridlock
The power grid is struggling to meet the growing demands of our electrifying world. In this episode of Chalk Talk, Amelia Dalton and Jake Michels from YAGEO Group discuss the challenges affecting our power grids today, the solutions to help solve these issues and why passive components will be the heroes of grid modernization.
Nov 28, 2023
19,851 views