industry news
Subscribe Now

Allegro MicroSystems, LLC Introduces New Hall-Effect Speed/Direction Sensor IC With Hysteresis Detection

Worcester, MA – February 17, 2015 – Allegro MicroSystems, LLC introduces a new Hall-effect speed and direction sensor IC with hysteresis detection. The A1232 is a highly sensitive, temperature stable, magnetic sensing device ideal for use in ring magnet based speed and direction systems in harsh automotive and industrial environments. It is the first device of its kind with the ability to detect when it powers up in the magnetic hysteresis band. This feature reduces angle accuracy error, which can occur when edges are missed at start-up. This new magnetic sensor IC is targeted at the automotive motor market. Key applications include: window lifts, sunroofs, sliding doors, and tail/trunk lift gates. This new device is also suitable for applications such as garage door openers and window blinds.

Allegro’s A1232 includes dual Hall elements spaced 1.63 mm apart that are photolithographically aligned within 1 µm. The precise spacing of the sensing elements eliminates a major manufacturing hurdle encountered when using fine pitch ring magnets. The signals from the dual Hall elements are encoded into logic outputs representing the speed and direction of the target. Factory trimming and Allegro’s proprietary Chopper Stabilization / Dynamic Offset Cancellation techniques provide precise, symmetrical magnetic switch-points over a wide range of operating conditions.

A built-in voltage regulator, short-circuit protected outputs, internal Zener clamps, reverse battery protection, and a -40°C to +150°C operating range give the A1232 the ruggedness demanded by automotive applications.

The A1232LLETR-T is available in an 8-pin TSSOP (suffix LE) surface mount package and is priced at $1.01 in quantities of 1,000. 

About Allegro

Allegro MicroSystems, LLC is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro’s innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. Allegro is headquartered in Worcester, Massachusetts (USA) with design, applications, and sales support centers located worldwide. Further information about Allegro can be found at www.allegromicro.com.

Leave a Reply

featured blogs
Apr 16, 2024
In today's semiconductor era, every minute, you always look for the opportunity to enhance your skills and learning growth and want to keep up to date with the technology. This could mean you would also like to get hold of the small concepts behind the complex chip desig...
Apr 11, 2024
See how Achronix used our physical verification tools to accelerate the SoC design and verification flow, boosting chip design productivity w/ cloud-based EDA.The post Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud appeared ...
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
31,435 views