industry news
Subscribe Now

Xilinx SDAccel Development Environment for OpenCL, C, and C++, Achieves Khronos Conformance

SAN JOSE, Calif.Jan. 14, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that the SDAccel™ development environment for OpenCL™, C, and C++ is now Khronos OpenCL 1.0 standard compliant. The OpenCL standard provides a uniform programming environment for software developers to write efficient, portable code enabling a rich range of algorithms to be easily accelerated on Xilinx FPGAs. SDAccel, the newest member of the SDx™ family, includes an architecturally optimizing compiler for OpenCL, C, and C++ and is proven to deliver up to 25X better performance/watt compared to CPUs or GPUs and 3X the performance and resource efficiency of other FPGA solutions.  

SDAccel combines the industry’s first architecturally optimizing compiler supporting OpenCL, C, and C++ kernels, along with libraries, development boards, and a complete CPU/GPU-like development and run-time experience for FPGAs.

“We are excited to see Xilinx’s support for the OpenCL standard for parallel programming of heterogeneous systems. FPGAs are a natural fit for compute intensive algorithms where high throughput, low latency and low power are critical to meet system requirements,” said Neil Trevett, president of the Khronos Group and chair of the OpenCL working group. “Now the entire OpenCL design community can seamlessly take advantage of Xilinx FPGAs.”

Availability

To access the capabilities of SDAccel, please contact your local sales representative.  To learn more visitwww.xilinx.com/sdaccel. The product is conformant with Khronos OpenCL 1.0 specification.

About SDx

SDx is a family of development environments for systems and software engineers. SDx enables developers with little or no FPGA expertise to use high level programming languages to leverage the power of programmable hardware with industry standard processors. To learn more visit www.xilinx.com/sdx.

About Xilinx

Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,336 views