SAN FRANCISCO, CA – The world’s leading scientists and engineers in micro and nanoelectronics will convene here from December 15-17, 2014 at the annual IEEE International Electron Devices Meeting (IEDM), continuing the conference’s tradition of spotlighting technical breakthroughs in a wide range of applications such as logic, memory, MEMs, sensors, displays, flexible electronics, biomedical imaging, power electronics and energy harvesting.
The 60th annual IEDM will take place at the Hilton San Francisco Union Square Hotel, preceded by day-long short courses on Sunday, Dec. 14 and a program of 90-minute tutorials on Saturday, Dec. 13. In addition to the technical program, other events such as evening panels, special focus sessions, IEEE awards and an entrepreneurial session will take place during the meeting.
The heart of every IEDM technical program is a focus on core semiconductor technology, but, in keeping with the growth in mobile computing and communications, and with the expansion of electronics into many new areas, the 2014 meeting will have a greater overall emphasis on circuit and process technology interactions, bio?sensors and bioMEMS, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, devices for non?Boolean computing, and multiferroics.
Many papers on these topics will be given in regular sessions throughout the conference, while others will be grouped in these designated focus sessions:
• Advanced Displays
• Analog Circuits and Devices
• Bio-MEMS
• Power Devices and Applications
“The IEDM conference has long been the place where the world’s experts have presented breakthroughs in transistors, memory devices and related semiconductor technologies,” said Suman Datta, IEDM 2014 Publicity Chair and Professor of Electrical Engineering at Penn State University. “The tradition of attracting the best speakers and a large, diverse audience from around the world continues as we mark the conference’s 60th anniversary, with an added focus on emerging areas of importance where semiconductor technology is expected to play an expanding and enabling role.”
The 2014 IEDM technical program comprises some 213 presentations. It features talks exploring topics such as:
• how advanced power semiconductors are helping the world save huge amounts of energy while dramatically reducing greenhouse gas emissions;
• how MEMS technology is driving advances in understanding the pathophysiology of Alzheimer’s Disease, and is enabling faster, cheaper, better DNA sequencing;
• how silicon thin-film transistors can be built on arbitrary substrates like paper or cheap plastics;
• how efficient energy-storage devices can be made using porous silicon and integrated with electronic circuitry on a single chip;
• ways in which CMOS scaling will be extended effectively to the 10-nm node and beyond;
• new memories, various types of 3D circuits, and many other topics that are both fascinating and fundamental to the advancement of a sustainable digital future for humanity.
Highlighted papers on these and other important topics can be found in the Tip Sheet available via the “Press Kit” link on the IEDM website (www.ieee-iedm.org), or directly from the IEDM Editor Press Center at www.btbmarketing.com/iedm.
Here are some of the noteworthy events that will take place at this year’s IEDM:
90-Minute Tutorials — Saturday, Dec. 13
A program of 90-minute tutorial sessions on emerging topics will be presented by experts in the fields. They are meant to bridge the gap between textbook-level knowledge and leading-edge current research. The tutorials will be presented in parallel in two time slots. Advance registration is required.
• Physical Characterization of Novel Materials and Devices for Logic and Memory, by W. Vandervorst and D. Cooper from Imec
• Reliability Characteristics of CMOS Transistors Post Si/SiO2/poly-Si Gate Stack Scaling, by Eduard Cartier from IBM Research
• Power Semiconductor Device Basics: History, Application and Physics, by Ichiro Omura from Kyushu Institute of Technology
• Power Electronics for a Smart Energy Future, by Johan Driesen from KU Leuven
• Nonvolatile Memories: Old and New, by Jan Van Houdt from Imec
• Optoelectronics of Graphene and other 2D Materials, by Phaedon Avouris from IBM Research
Short Courses — Sunday, Dec. 14
The IEDM will host two Sunday short courses, providing the opportunity to learn about important areas and developments, and to benefit from direct contact with expert lecturers. Advance registration is required. This year’s courses are:
• Challenges of 7nm CMOS Technology, organized by Hidenobu Fukutome from Samsung
• 3D System Integration Technology, organized by Eric Beyne from Imec
Plenary Presentations — Monday, Dec. 15
IEDM 2014 will open on Monday, Dec. 15 at 9 a.m. with these three plenary talks:
• SiC MOSFET Development for Industrial Markets, by John Palmour from Cree Inc.
• Are 3D atomic printers around the corner? by Enrico Prati from CNR IMM (Italy’s Institute for Microelectronics and Microsystems)
• Research into ADAS with Driving Intelligence for Future Innovation by Hideo Inoue from Toyota
Luncheon Presentation — Tuesday, Dec. 16
The IEDM Luncheon presentation will be given by T. J. Rodgers, the founder, President, CEO and a director of Cypress Semiconductor Corporation.
Evening Panel Sessions — Tuesday evening, Dec. 16
The IEDM offers attendees two evening panel discussions. Audience participation is encouraged to foster an open and vigorous exchange of ideas. The panel topics are:
• 60 Years of IEDM and Counting, moderated by Krishna Saraswat from Stanford.
• The Semiconductor Industry in 2024, moderated by Thomas Theis from IBM.
Entrepreneurs Lunch — Wednesday noon, Dec. 17
Jointly sponsored by IEDM and IEEE Women in Engineering, the IEDM Entrepreneurs Lunch is back for a third year. The speaker will be Kathryn Kranen, Corporate Vice President and General Manager at Cadence Design Systems, Inc. Ms. Kranen will discuss how she led two start-ups to success, in each case transforming an emerging technology into a mainstream one. She did that with Verisity Design, Inc. and with Jasper Design Automation, Inc., both of which subsequently were acquired by Cadence. She had been CEO at both companies. Ms. Kranen was awarded the ACE Lifetime Achievement Award in 2013 for contributions to the electronics industry.
Further information
For registration and other information, visit the IEDM 2014 home page www.ieee-iedm.org, or contact:
Follow IEDM via social media
• Twitter: twitter.com/#!/ieee_iedm | @ieee_iedm
• Facebook: http://www.facebook.com/IEEE.IEDM
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