industry news
Subscribe Now

eSilicon adds GDSII handoff to suite of online SoC automation tools

SAN JOSE, Calif. — May 23, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the expansion of its online automation suite with the addition of a GDSII portal that allows eSilicon to provide rapid, automated quoting for TSMC foundry technologies. eSilicon will demonstrate this capability at the 51st Design Automation Conference (DAC), to be held at the Moscone Convention Center in San Francisco, California from June 2 to June 4, 2014.

Building on the successful introduction of its instant online quoting system for multi-project wafer (MPW) shuttle services, eSilicon’s GDSII portal offers the ability to fully specify the manufacturing process requirements for submission of a GDSII design to TSMC for manufacturing. The required manufacturing process information is specified through a series of easy-to-use menus, along with requirements for packaging, testing and delivery. An executable quotation from eSilicon is provided that includes non-recurring engineering (NRE) pricing and unit pricing for the system-on-chip (SoC) device.

Due to the highly interactive nature of the GDSII portal, customers receive immediate feedback from eSilicon on their choices for design and manufacturing. This interactive experience aids in the exploration of process and design options, facilitating a design optimized for power, performance and area (PPA) as well as NRE and unit cost.

“TSMC’s Value Chain Aggregators such as eSilicon provide options for customers to work with TSMC, and this automated GDSII portal brings more choices to customers in a highly efficient manner,” said Brad Paulsen, Senior Vice President, TSMC North America.

“Specifying all the information required to generate a complete quotation for volume manufacturing of a new SoC design can take weeks of effort,” said Mike Gianfagna, vice president of marketing at eSilicon. “Our new GDSII portal provides one place where all of this information is readily available. The time required to produce a quote is now a few minutes vs. a few weeks. We’re delighted to be offering this new capability in cooperation with TSMC.”

More information about eSilicon’s new GDSII quoting system may be found here.

eSilicon will be demonstrating the GDSII quoting system in booth 512 at DAC. You can find more information about eSilicon’s other planned activities at DAC here.

Availability

The GDSII portal will be available for general customer use in late June 2014. Access will be through eSilicon’s public website. Please click here if you would like to be notified when the GDSII portal is publicly available. 

About eSilicon

eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk, automated path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.

eSilicon — Enabling Your Silicon Success™ 

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Current Sense Shunts
Sponsored by Mouser Electronics and Bourns
In this episode of Chalk Talk, Amelia Dalton and Scott Carson from Bourns talk about the what, where and how of current sense shunts. They explore the benefits that current sense shunts bring to battery management and EV charging systems and investigate how Bourns is encouraging innovation in this arena.
Jan 23, 2024
12,873 views