industry news
Subscribe Now

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. 

The oxidation-inhibiting properties of Indium10.1 promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations. 

Indium10.1 enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance. 

Indium10.1 Solder Paste is part of Indium Corporation’s family of high performance, lead-free solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each specific manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping. 

For more information about Indium10.1 or the Pb-free Solder Paste series, visit www.indium.com/solder-paste-and-powders/leading-pb-free-solder-pastes or email askus@indium.com.  

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.  

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Shift Left with Calibre
In this episode of Chalk Talk, Amelia Dalton and David Abercrombie from Siemens investigate the details of Calibre’s shift-left strategy. They take a closer look at how the tools and techniques in this design tool suite can help reduce signoff iterations and time to tapeout while also increasing design quality.
Nov 27, 2023
19,439 views