industry news
Subscribe Now

Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High Temperature Materials for High-Speed Telecommunication Industries and Bendable Electronic Devices

Peapack, NJ, Basel, Switzerland, January 27, 2014 —  Novoset, LLC and Lonza are pleased to announce the introduction of PrimasetTM ULL-950 and PrimasetTM HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries. These thermoset resins are based on Cyanate ester (CE) chemistry. PrimasetTM ULL-950 is suitable for high-performance applications such as power amplifiers for 4G LTE and 4G LTE advanced base stations for smartphones, internet infrastructure and high-layer count servers for “cloud computing”. Low dielectric properties coupled with high Glass transition temperature (Tg) makes PrimasetTM HTL-300 an ideal candidate for advanced Integrated Circuit (IC) substrates for semiconductor packaging materials and next generation application processors for mobile chips. Depending on the backbone structure PrimasetTM ULL-950 has a dissipation factor (Df) ranging from 0.0009 to 0.003 and dielectric constant (Dk) between 2.3 – 2.6 up to 40 GHz. The Tg can vary between 175 – 320?C. High temperature bendable devices can be fabricated utilizing its flexibility. These products also exhibit low moisture uptake and short lamination cycles. The high temperature capabilities and toughness are critical for lead-free assemblies in Printed Circuit Boards (PCB) and build-up films.  Low moisture uptake and wet Tg retention with toughness also may open the door for the use of these Cyanate esters for structural aerospace applications.

The processing of these materials is similar to epoxy resins and other commercial PrimasetTM materials. The products co-react with epoxy resins, Polyphenylenether (PPE), Styrene maleic anhydride (SMA), Triallyl cyanurate (TAC), Bismaleinimide (BMI), Vinyl polymers, Primaset™ BA-230S, Primaset™ BA-3000, and other Cyanate esters. The products are soluble in Methyl ethyl ketone (MEK), Toluene, Xylenes and other solvents at high concentration. These products also give excellent adhesive characteristics with various substrates and can be highly filled with fillers for low CTE applications. Dr. Sajal Das, President & CEO of Novoset, LLC stated: “We can design and fabricate high-layer count ultra-low dielectric boards without using Teflon™. PrimasetTM ULL-950’s electrical performance is similar to Polytetrafluoroethylene, it can be processed as easy as FR-4 technology and reaches Tg of Cyanate esters or Polyimides”. He further commented that: “We are getting close to fabricating bendable tablets, smartphones and other devices from high temperature thermosets such as derivatives of PrimasetTM ULL-950 and PrimasetTM HTL-300 in the foreseeable future.”

ULL-950 and HTL-300 were developed at Novoset Technology Center, in Berkeley Heights, NJ. Lonza will manufacture and market these two products globally under Primaset™ trade name.

About Novoset, LLC

Novoset, LLC was established in 2011 as a product design, development and marketing company specializing in high performance thermoset plastics and formulated intermediate products for the electronics, aerospace, space and defense industries. Novoset, LLC has opened its Technology Center in October 2012. Lonza is Novoset’s manufacturing partner.

Novoset, LLC is located in Peapack, New Jersey, USA. Further information can be found at

www.novoset.com

About Lonza

Lonza is one of the world’s leading suppliers to the pharmaceutical, healthcare and life science industries. Products and services span its customers’ needs from research to final product manufacture. It is the global leader in the production and support of chemical and biological active pharmaceutical ingredients. Biopharmaceuticals are one of the key growth drivers of the pharmaceutical and biotechnology industries. Lonza has strong capabilities in large and small molecules, peptides, amino acids and niche bioproducts which play an important role in the development of novel medicines and healthcare products. Lonza is also the world leader in microbial control providing innovative, chemistry-based and related solutions to destroy or to selectively inhibit the growth of harmful microorganisms. Its activities encompass the areas of water treatment, personal care, health and hygiene, industrial preservation, materials protection, and wood treatment. In addition, Lonza is a leader in cell-based research, endotoxin detection and cell therapy manufacturing. Furthermore, the company is a leading provider of ingredients to the nutrition and agro markets world and a leading producer of thermoset resins and various advanced intermediates with backward integrated feedstock capabilities.

Lonza is headquartered in Basel, Switzerland and is listed on the SIX Swiss Exchange and secondary listed on the Singapore Exchange Securities Trading Limited (“SGX-ST”). Lonza is not subject to the SGX-ST’s continuing listing requirements. Lonza is subject to the listing rules of the SIX Swiss Exchange, which do not have specific requirements equivalent to the listing rules of the SGX-ST in respect of interested person transactions, acquisition and realizations, and delisting. In 2012, the company had sales of CHF 3’925 million. Further information can be found at www.lonza.com.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Must be Thin to Fit: µModule Regulators
In this episode of Chalk Talk, Amelia Dalton and Younes Salami from Analog Devices explore the benefits and restrictions of Analog Devices µModule regulators. They examine how these µModule regulators can declutter PCB area and increase the system performance of your next design, and the variety of options that Analog Devices offers within their Ultrathin µModule® regulator product portfolio.
Dec 5, 2023
18,633 views