fresh bytes
Subscribe Now

Not a blimp, not a plane: the gigantic Aeroscraft is ready, and it’s awesome

aeroscraft.png

This is a new type of rigid aircraft. It’s not a blimp, and it’s not an airplane, but this thing has the potential to alter the way we understand travel and completely change military transportation. You can see a video of its first move here.

According to the company, “the final configuration and vehicle systems integration functionality testing has been completed as the Aeroscraft subscale demonstration vehicle reaches the finish line.” The aircraft will enter a flying tests phase over the next 60 days. After they are done with the testing, they will build the full scale version. Yes, this gigantic aircraft is only a small version of what’s coming. Imagine that.
via Gizmodo

Continue reading 

Leave a Reply

featured blogs
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...
Apr 16, 2024
Learn what IR Drop is, explore the chip design tools and techniques involved in power network analysis, and see how it accelerates the IC design flow.The post Leveraging Early Power Network Analysis to Accelerate Chip Design appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
16,623 views