fresh bytes
Subscribe Now

Astronomers discover youngest fully formed exoplanet ever known

PIA20690_hires.jpg

Astronomers using NASA’s Kepler Space Telescope and its extended K2 mission, as well as the W. M. Keck Observatory on Mauna Kea, Hawaii, have discovered the youngest fully formed exoplanet ever detected. Exoplanets are planets that orbit stars beyond our sun.

The newfound planet, K2-33b, is a little larger than the planet Neptune, and orbits tightly and rapidly around its star every five days. It is only 5 to 10 million years old, making it one of a very few newborn planets found to date.
via Boing Boing

Continue reading 

Leave a Reply

featured blogs
Mar 18, 2024
If you've already seen Vivarium, or if you watch it as a result of reading this blog, I'd love to hear what you think about it....
Mar 18, 2024
Innovation in the AI and supercomputing domains is proceeding at a rapid pace, with each new advancement heralding a future more tightly interwoven with the threads of intelligence and computation. Cadence, with the release of its Millennium Platform, co-optimized with NVIDIA...
Mar 18, 2024
Cloud-based EDA tools are critical to accelerating AI chip design and verification; see how NeuReality leveraged cloud-based chip emulation for their 7NR1 NAPU.The post NeuReality Accelerates 7nm AI Chip Tape-Out with Cloud-Based Emulation appeared first on Chip Design....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

Reliable Connections for Rugged Handling
Sponsored by Mouser Electronics and Amphenol
Materials handling is a growing market for electronic designs. In this episode of Chalk Talk, Amelia Dalton and Jordan Grupe from Amphenol Industrial explore the variety of connectivity solutions that Amphenol Industrial offers for materials handling designs. They also examine the DIN charging solutions that Amphenol Industrial offers and the specific applications where these connectors can be a great fit.
Dec 5, 2023
13,880 views