fish fry
Subscribe Now

My Substrate or Yours?

Fish Fry is getting down to bare metal. We’re talking the who, what, where, and how of multi-substrate technology and checking out why the tools of today may not be up to snuff for tomorrow’s 3D IC packaging. Also this week, we look at the challenges of 100G designs and investigate why Portland, Oregon was ranked the second nerdiest city in the United States.

I’ve got a Microchip TCHIP003 chipKIT™ Starter Pak – courtesy of Mouser and Microchip Technology to give away this week. You can enter to win one by posting a comment on this week’s Fish Fry page.

Listen to this episode
Download this episode (right click and save)



Listen to Previous Fish Frys

Fish Fry Links – April 11, 2013

More Information about The Top Ten Nerdiest Cities in America

More Information about CDNLive

New Chalk TalkHD – Solving the 100G Challenge with ABAX2

More Information about the Microchip TCHIP003 chipKIT™ Starter Pak

 

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Exploring the Potential of 5G in Both Public and Private Networks – Advantech and Mouser
Sponsored by Mouser Electronics and Advantech
In this episode of Chalk Talk, Amelia Dalton and Andrew Chen from Advantech investigate how we can revolutionize connectivity with 5G in public and private networks. They explore the role that 5G plays in autonomous vehicles, smart traffic systems, and public safety infrastructure and the solutions that Advantech offers in this arena.
Apr 1, 2024
3,170 views