editor's blog
Subscribe Now

TSVs: Like Vias, Only 1000X Deeper

We recently looked at Applied Materials’ solution to the challenges of lining small vias: using cobalt. But those are through-dielectric vias. What about through-silicon vias (TSVs)? After all, they can be a thousand times deeper than a standard via, so if a standard via is hard to cover, imagine how hard it must be for a TSV.

Of course, we’re talking a wider via, but AMAT says that standard physical vapor deposition (PVD) tools do an inadequate job of coating the TSVs when applying the barrier, for lots of the same reasons we discussed in the cobalt story.

Their solution to the TSV issue isn’t quite as radical as a new metal; it involves tightening up the angle of dispersion for the metals, providing better coverage. With better coverage, the barrier can also be made thinner, saving cost. A thinner layer is faster to deposit, improving throughput (and reducing cost).

Figure.png

 

(Image courtesy Applied Materials)

In addition, they’ve built a production-worthy chamber for use with titanium rather than the more typical “proven” tantalum. Titanium apparently being cheaper than tantalum. Both can be integrated with the copper seed.

You can read more about their Ventura PVD in their announcement.

Leave a Reply

featured blogs
Sep 21, 2018
在这我们谈论的不是您的叠层设计跟其他人比怎么样,而是您设计的 PCB 层叠结构,是刚性板、柔性板、刚...
Sep 21, 2018
  FPGA luminary David Laws has just published a well-researched blog on the Computer History Museum'€™s Web site titled '€œWho invented the Microprocessor?'€ If you'€™re wildly waving your raised hand right now, going '€œOoo, Ooo, Ooo, Call on me!'€ to get ...
Sep 20, 2018
Last week, NVIDIA announced the release of the Jetson Xavier developer kit. The Jetson Xavier, which was developed in OrCAD, is designed to help developers prototype with robots, drones, and other......
Sep 18, 2018
Samtec performs several tests in-house as part of our qualification testing on a product series; including Low Level Contact Resistance (LLCR). It measures the amount of resistance in a position on a part. LLCR is used in combination with several other tests to track the over...