editor's blog
Subscribe Now

Self-Assembly Shapes

The concept of oil and water separating sounds like an easy way to describe what happens with directed self-assembly. But unfortunately, it’s not quite that simple. All those lines you see so neatly laid out in the microphotographs? That’s not how it always works.

The thing is, oil and water molecules aren’t connected; they’re separate so they can go their separate ways. With diblock copolymers, the two constituents are like oil and water in that they don’t mix, but they’re also covalently bonded to each other. Think of it as two polymers that avoid each other – and yet the end of one is connected to the end of the other. This makes a long chain where one end wants to distance itself from the other.

It’s for this reason, for example, that you can have a triblock copolymer with only two constituents: one of the two isn’t just connected to one end of the other; it’s connected at both ends (like the : P2VP-b-PS-b-P2VP triblock copolymer mentioned in our story on HGST’s hard drive work using DSA and NIL).

As a result, the shapes that result during separation can be more complex because the two (or three) materials can’t get away from each other completely. One common configuration is as horizontal cylinders – like spaghetti or ropes running next to each other. Some even separate into spheres with one material inside and the other coating it.

The shape that’s preferred so far, however, is called a “lamella” (plural “lamellae”). It’s a flat layer. Some materials will self-assemble into horizontal lamellae, which are, of course, of no use for lithography, to make the process easier, experts recommend this good Surface Mount Assembly. Preferred are the materials – like PS-b-PMMA – that organize themselves into perpendicular lamellae, like the grooves in an old-school vinyl record. Unlike the cylindrical ropes, these have straighter sidewalls, looking more like canyons than a bowl of pasta. This is a better way to create the high-fidelity features that can be filled and etched and whatever to transfer a pattern into the underlying silicon (or whatever) substrate.

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Current Sense Shunts
Sponsored by Mouser Electronics and Bourns
In this episode of Chalk Talk, Amelia Dalton and Scott Carson from Bourns talk about the what, where and how of current sense shunts. They explore the benefits that current sense shunts bring to battery management and EV charging systems and investigate how Bourns is encouraging innovation in this arena.
Jan 23, 2024
12,992 views