editor's blog
Subscribe Now

3D IC Design Suite

There’s lots of talk about 3D (and 2-1/2-D) ICs, with through-silicon vias (TSVs) being a key enabling technology. The possibilities are exciting, but the reality also appears to be challenging. Costs are high, there are still reliability questions to answer, and the overall design flow has yet to be thoroughly established. Even just simple questions like place and route have been the subject of early projects (involving at least one company that’s no longer in business).

Synopsys has recently announced their 3D-IC Initiative, essentially a collection of their EDA tools focused on hacking a flow through this technology jungle. It includes digital and custom design support, test, parasitic extraction, memory compilation, simulation, and more. All of which are impacted by 3D IC design.

Even though you might wonder, “How hard can it be to stack one die on top of another?” the answer appears to be, “Pretty hard.” At least until the tools settle down to make it easier.

More details in their release

Leave a Reply

featured blogs
Jul 20, 2018
https://youtu.be/KwrfcMtbMDM Coming from CDNLive Japan (camera Asushi Tanaka) Monday: Nicolas's Recipe for Digital Marketing in EDA Tuesday: Embargoed announcement Wednesday: Trends, Technologies, and Regulation in China's Auto Market Thursday: Breakfast Bytes Guide...
Jul 19, 2018
In the footer of Samtec.com, we'€™ve always made it easy to contact us by phone, email, or live chat (even fax back in the day!). To continue to progress this theme, you'€™ll now find a new helpful tool in the footer area of Samtec.com. This tool will match you up with yo...
Jul 16, 2018
Each instance of an Achronix Speedcore eFPGA in your ASIC or SoC design must be configured after the system powers up because Speedcore eFPGAs employ nonvolatile SRAM technology to store the eFPGA'€™s configuration bits. Each Speedcore instance contains its own FPGA configu...
Jul 12, 2018
A single failure of a machine due to heat can bring down an entire assembly line to halt. At the printed circuit board level, we designers need to provide the most robust solutions to keep the wheels...