editor's blog
Subscribe Now

Safe Processing

When we recently looked at software and hardware safety standards, much of the discussion was focused on process-oriented standards like DO-254 and DO-178. But we also mentioned some other standards without going into detail. And some of those operate on the concept of “safety integrity level,” or SIL.

The origin of this concept is IEC 61508, which establishes four SILs, numbered 1-4, with 4 indicating the “safest” level. The determination of SIL appears to be relatively complex and somewhat ambiguous since the specific failure modes must be identified for each individual system, and are not codified in IEC 61508. They involve both process considerations as well as the Probability of Failure on Demand, or PFD,  (or its inverse, the Risk Reduction Factor, or RRF).

It’s actually pretty easy to understand the PFD ranges for each SIL: it’s the maximum number of zeros after the decimal for the PFD (or the minimum number of zeros in the RRF). So SIL 1 applies to a PFD of 0.1 to 0.01 (or an RRF of 10 to 100); SIL 4 applies to a PFD of 0.0001-0.00001 (or an RRF of 10,000-100,000).

ISO 26262 has a similar concept for automobiles, referring to Automotive SILs, or ASILs.

Only systems can achieve a SIL level; components may tout a SIL level, but simply using such components (or a process known to have achieved a certain SIL level on a different product) is not sufficient to demonstrate that SIL level. So, for instance, when TI just announced their Hercules microcontrollers, they didn’t say that “these  microcontrollers conform to SIL x.” They listed a series of features that are specifically designed to help a designer achieve a desired SIL or ASIL.

Because these standards don’t call out specific functional requirements, only probabilities of failure and process requirements, the feature list itself can’t be expressly correlated with specifics of the standard. Again, they’re simply things that are known to allow the implementation of safer systems.

More details and the specific features can be found in TI’s release

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electrical Connectors for Hermetically Sealed Applications
Sponsored by Mouser Electronics and Bel
Many hermetic chambers today require electrical pathways to provide internal equipment with power, data or signals, or to receive data and signals from equipment within the chamber. In this episode of Chalk Talk, Amelia Dalton and Brad Taras from Cinch Connectivity Solutions explore the role that seals and connectors play in the performance of hermetic chambers. They examine the methodologies to determine hermetic seal leaks, the benefits of epoxy hermetic seals, and how Cinch Connectivity’s epoxy-based seals and hermetic connectors can add value to your next design.
Aug 22, 2023
29,189 views